this is information on a product in full production. april 2013 docid024381 rev 1 1/9 9 stps2200 power schottky diode datasheet ? production data features ? low forward voltage drop ? very small conduction losses ? negligible switching losses ? extremely fast switching ? low thermal resistance ? -40c minimum operating t j ? ecopack ? 2 compliant component description this device is a 200 v schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in smb, smbfla t, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. also idea l for all led lighting applications. table 1. device summary symbol value i f(av) 2 a v rrm 200 v t j(max) 175 c v f(typ) 0.58 v k a smb STPS2200U a k k a smbflat STPS2200Uf www.st.com
characteristics stps2200 2/9 docid024381 rev 1 1 characteristics to evaluate the maximum conduction losses use the following equation: p = 0.58 x i f(av) + 0.03 i f 2 (rms) note: more information is availa ble in the application notes: an604 calculation of conduction losses in a power rectifier an4021 calculation of reverse losses in a power diode table 2. absolute ratings (limiting value s, at 25 c unless otherwise stated) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward rms current 10 a i f(av) average forward current ? = 0.5, square wave smb t l = 145 c 2a smbflat t l = 150 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t l = 25 c 100 a t stg storage temperature range -65 to +175 c t j operating junction temperat ure range -40 to +175 c table 3. thermal parameters symbol parameter value unit r th(j-l) junction to lead smb 20 c/w smbflat 15 table 4. static electrical characteristics symbol test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 5a t j = 125 c 0.7 2.5 ma v f (1) forward voltage drop t j = 25 c i f = 2 a 0.73 0.80 v t j = 125 c 0.58 0.64 v 1. pulse test: t p = 380 s, ? < 2%
docid024381 rev 1 3/9 stps2200 characteristics figure 1. average forward power dissipation versus average forward current figure 2. forward voltage drop versus forward current p f(av) (w) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 t =tp/t tp = 0.05 = 1 = 0.5 = 0.2 = 0.1 i f(av) (a) i f (a) 1.e-02 1.e-01 1.e+00 1.e+01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 t j =125c (typical values) t j =25c (maximum values) t j =25c (typical values) t j = 125 c (maximum values) v f (v) figure 3. reverse leakage current versus reverse voltage applied (typical values) figure 4. junction capacitance versus reverse voltage applied (typical values) i r (ma) 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 0 20 40 60 80 100 120 140 160 180 200 t j = 150 c t j = 50 c t j = 100 c t j = 125 c t j = 25 c t j = 75 c v r (v) c(pf) 10 100 1000 1 10 100 1000 v r (v) f = 1 mhz v osc = 30 mv rms t j = 25 c figure 5. relative variation of thermal impedance junction to lead versus pulse duration (smb) figure 6. relative variation of thermal impedance junction to lead versus pulse duration (smbflat) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 single pulse smb z th(j-l) /r th(j-l) t p (s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 single pulse smbflat t p (s) z th(j-l) /r th(j-l)
characteristics stps2200 4/9 docid024381 rev 1 figure 7. thermal resistance junction to ambient versus copper surface under each lead (smb) figure 8. thermal resistance junction to ambient versus copper surface under each lead (smbflat) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smb s cu (cm2) epoxy printed circuit board fr4 copper thickness = 35 m r th(j-a) (c/w) r th(j-a) (c/w) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smbflat epoxy printed circuit board fr4 copper thickness = 35 m s cu (cm2)
docid024381 rev 1 5/9 stps2200 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package ? cooling method: by conduction (c) ? recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. smb dimension definitions table 5. smb dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b
package information stps2200 6/9 docid024381 rev 1 figure 10. smb footprint, dimensions in mm (inches) figure 11. smbflat (non exposed pad) dimension definitions table 6. smbflat (non exposed pad) dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 1.30 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.23) (0.064) (0.086) d a l2x l l1 2x l2 2x e e1 b c
docid024381 rev 1 7/9 stps2200 package information figure 12. smbflat (non exposed pad) footprint dimensions 1.20 (0.047) 1.20 (0.047) 3.44 (0.136) 5.84 (0.230) 2.07 (0.082) millimeters (inches)
ordering information stps2200 8/9 docid024381 rev 1 3 ordering information 4 revision history table 7. ordering information ordering type marking package weight base qty delivery mode STPS2200U g22 smb g 2500 tape and reel STPS2200Uf fg22 smbflat g 5000 tape and reel table 8. document revision history date revision changes 11-apr-2013 1 first issue
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